Modeling of temperature fields inside two layers board copper - plastic materials during treatment

Abstract

We are dealing with the possibility of electronic waste separation by the temperature effect. It gives a possible direction how to solve the problem of electronic waste growth not only in Czech Republic, but also throughout the world. Further, we are dealing with a heat transfer inside the printed circuit boards (PCBs). With the usage of the utilized experience from detail references background research and various software simulators we achieved the maximum analysis of the problem. The solving, which resulted from the calculations. The development of new criteria for PCBs recycling has opened new possibilities of treatment for used materials.