Mathematical modeling of thermal management at different atmospheric pressure conditions

Abstract

Cooling process is an important element in the correct functioning of all electronic devices. While some components can resist high temperatures, others are damaged during overheating conditions. We performed numerical simulation to study the temperature variation during cooling process of electronic devices that are subject to the effect of different pressures. Commonly the correct functioning of instruments is tested under specific conditions given by the location of the manufacturer but generally the consumer uses the device in a different region. Cooling process performed by convection uses the air provided by a fan. Fluid properties such as kinematic viscosity are influenced by pressure and the effect in cooling is demonstrated by analyzing the variation of surface temperature at different pressures. This study allows us to understand the importance of fluid flow speed in controlling the heating rate. We performed numerical simulation at different air speed (10 - 20 m/s) and pressure (77 - 100 kPa) which corresponds to the elevation of cities that are located between 31mand 2240 m., additionally we studied the maximum amount of power dissipation as a function of air velocity with radiation contribution and without radiation effect.