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The electronic component authenticity verification

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dc.title The electronic component authenticity verification en
dc.contributor.author Neumann, Petr
dc.contributor.author Navrátil, Milan
dc.contributor.author Pospíšilík, Martin
dc.contributor.author Křesálek, Vojtěch
dc.contributor.author Adámek, Milan
dc.relation.ispartof Journal of Physics: Conference Series
dc.identifier.issn 1742-6588 Scopus Sources, Sherpa/RoMEO, JCR
dc.date.issued 2018
utb.relation.volume 1065
utb.relation.issue 10
dc.event.title 22nd World Congress of the International Measurement Confederation, IMEKO 2018
dc.event.location Belfast
utb.event.state-en United Kingdom
utb.event.state-cs Spojené království
dc.event.sdate 2018-09-03
dc.event.edate 2018-09-06
dc.type conferenceObject
dc.language.iso en
dc.publisher Institute of Physics Publishing
dc.identifier.doi 10.1088/1742-6596/1065/10/102014
dc.relation.uri http://iopscience.iop.org/article/10.1088/1742-6596/1065/10/102014
dc.description.abstract The article presents a brief insight into the university research of efficient methods aimed at revealing counterfeit electronic components. Methods like multichannel curve tracing, component internal structure X-raying, system on chip optical inspection with higher magnification microscopy and Scanning Electron Microscopy combined with Element Energy Dispersive Spectroscopy (EDS) are powerful means for authenticity verification. Comparative analysis results serve as an illustration of cases where various features differences can warn not to let a particular component delivery penetrate the assembly process. © 2018 Institute of Physics Publishing. All rights reserved. en
utb.faculty Faculty of Applied Informatics
dc.identifier.uri http://hdl.handle.net/10563/1008405
utb.identifier.obdid 43879152
utb.identifier.scopus 2-s2.0-85057479733
utb.source d-scopus
dc.date.accessioned 2019-01-31T08:59:00Z
dc.date.available 2019-01-31T08:59:00Z
utb.contributor.internalauthor Neumann, Petr
utb.contributor.internalauthor Navrátil, Milan
utb.contributor.internalauthor Pospíšilík, Martin
utb.contributor.internalauthor Křesálek, Vojtěch
utb.contributor.internalauthor Adámek, Milan
utb.fulltext.affiliation P Neumann 1, M Navrátil, M Pospíšilík, V Křesálek, M Adámek Tomas Bata University in Zlin, Faculty of Applied Informatics, nám.T.G.Masaryka 5555, 760 01 Zlín, Czech Republic E-mail: [email protected] 1 To whom any correspondence should be addressed.
utb.fulltext.dates -
utb.scopus.affiliation Tomas Bata University in Zlin, Faculty of Applied Informatics, nám.T.G.Masaryka 5555, Zlin, 760 01, Czech Republic
utb.fulltext.faculty Faculty of Applied Informatics
utb.fulltext.faculty Faculty of Applied Informatics
utb.fulltext.faculty Faculty of Applied Informatics
utb.fulltext.faculty Faculty of Applied Informatics
utb.fulltext.faculty Faculty of Applied Informatics
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